This makes it ideal for use with the components used in mass produced electronics products. Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board. The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board. Infrared reflow soldering has been used for many years in PCB assembly areas, and it is now able to provide very high quality soldering that can meet the needs to todays electronics production areas. It provides reliable soldering for the huge variety of component and pad sizes required, whilst being easy to monitor and control. Reflow soldering is the most widely used form of soldering used for PCB assembly.
#Reflow soldering process how to
See also: Soldering basics Manual soldering: how to solder Soldering irons Tools for soldering Solder - what it is and how to use it De-soldering - the secrets of how to do it properly Solder joints SMT soldering techniques Wave soldering Reflow soldering Soldering BGAs What is solder paste & how to use it Reflow Soldering for PCB Assembly Reflow soldering is widely used for PCB assembly and manufacture where it offers the most reliable and effective form of soldering.
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